Marking the correct joint centerlines

Joint-cut marking across a row of dowels is influenced by many factors and often does not
align with the actual dowel positions. Incorrect marking is a common cause of significant
lateral dowel translation, which can reduce load-transfer efficiency across panels.
MIT-Joint-Finder determines and marks the correct centerline based on the actual dowel
locations. Using an electromagnetic detection method, the device ensures reliable joint
marking for accurate saw cuts.

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Efficient joint layout workflow

In slipform paving with DBI, joint -cut marking is typically tied to dowel placement. Common
errors include pin misalignment, trigger misadjustment, manual marking inaccuracies, curve
geometry issues, and poor mark visibility.
Using measured dowel positions for the saw line decouples layout from DBI triggers and pin
references while avoiding manual errors. This approach places joint layout closer to the cutting
operation, creating a more coherent workflow and improving overall consistency.

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Intuitive, simple and quick operation

The operator simply guides the device along the pavement edge. As the unit moves over the
dowels at the ends of the joint line, it automatically detects their center and places precise
marks within seconds.
This effortless process provides accurate reference points for snapping chalk lines that guide
the saw during joint cutting.

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Technical specifications

Detection accuracy:  +.– 0.5 inches
Depth range: up to 8 inches
Spray yield: up to 1000 sprays per can
Display: LCD Color display (touchscreen)
Operating temperature: 30° F to 120° F
Power supply: NiMH battery 9.6 V / 3.8 Ah
Battery life: 8 hours
Recharge time: 2 hours
Dimensions:
Device: 19.7 in x 15.0 in x 6.3 in
Carrying case: 26.4 in x 22.4 in x 9.8 in
Weight:
Net weight: 11 lbs
Gross weight: 27 lbs (including equipment case)